Next-Generation Design and Technology Co-optimization (DTCO) of System on Integrated Chip (SoIC) for Mobile and HPC Applications

This paper demonstrates the next-generation design and technology co-optimization (DTCO) of system on integrated chip (SoIC) for mobile and HPC applications, where the SoIC technology was proposed to integrate multichips with different functionality and technology into a single SoC chip. The new DTCO includes overall die partitioning, die integration, and interconnect. These methodologies can be used for improving time-to-market and trade-off between performance and cost. In this paper, two prototypes of stacking CPU and memory dies are demonstrated with 15% performance gain and 30% average point-to-point distance reduction.