Multi-level modeling to OPC UA for migrating to Industry 4.0 in semiconductor manufacturing

Semiconductor industry has long been active in standardization of interfaces to deal with interoperability. Even though these standards allow interoperability between different hosts and equipment within the semiconductor industry, it remains hard to make these interfaces interoperable with other domains of manufacturing. One of the main pillars of Industry 4.0 is the interoperability of different equipment and devices across multiple domains and between the operational and information technologies. Though OPC UA is becoming the de facto architecture for Industry 4.0, semiconductor equipment manufacturers need to comply with the existing SEMI standards to ensure the sales of their equipment. In this context, the primary goal of this work is to develop a comprehensive metamodel of the SEMI communication interfaces. As a secondary goal, we want to use this model to carry out a preliminary experimentation on using OPC UA as a communication architecture in semiconductor industry, maintaining maximum compliance to the established SEMI standards.