Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package

3D packaging consists of a variety of architectures and types. Fault isolation and physical failure analysis (PFA) can involve non-destructive and destructive techniques. Previously, decapsulation techniques to gain access to individual dice in a 3D multi-die stacked package with very thin dice (100 μm) had been investigated. This paper introduces the sample preparation techniques required for the deprocessing of a thin die within the 3D multi-die stacked package.