Thermal Neutron Induced Soft Errors in 7-nm Bulk FinFET Node

Thermal neutron induced soft-errors in 7nm bulk FinFET technology are characterized as a function of supply voltage in this work. Results show that thermal neutron induced FIT rates can be as high as 250% of Alpha FIT rates and 12% of fast-neutron FIT rates. Slope of SER vs supply voltage curves is shown to be a function of particle type (fast neutrons, thermal neutrons, or alpha particles) and flip-flop design.