Effect of TiO2 nanoparticle on intermetallic compounds growth of Cu/Sn/Cu Solder Joint

With the development of electronic packaging technology, lead-free solders have been widely utilized in electronic devices in recent years. For this research, through the electrodeposition technique, the TiO
₂
nanoparticle was added into the Sn film to make the Sn-TiO
₂
composite solder joint. In order to study the effect of TiO
₂
nanoparticles on the Cu
₆
Sn
₅
growth behavior at solder joint interface, Comparing the thickness of IMC layer at the interface of pure Sn solder joint and the composite solder joint. After soldering for 30s, 60s, 150s and 300s, the average thickness of the IMC layer at the Cu/Sn-TiO
₂
/Cu solder joint interface is decreased comparing with the pure Sn solder. It shows that the growth of Cu
₆
Sn
₅
IMC at the interface of solder joints is inhibited by the addition of TiO
₂
nanoparticles; The addition of TiO
₂
nanoparticles inhibits the growth of Cu
₆
Sn
₅
at solder joint interface, which is due to the adsorption of TiO
₂
nanoparticles on the surface of Cu
₆
Sn
₅
grains, which make the Gibbs free energy on the surface of Cu
₆
Sn
₅
grains decrease. Hindering the growth of IMC at the interface of solder joint is important for improving the reliability of solder joints in electronic packaging industry.