Mems Stiction Suppression Using Low-Stress Camphor Sublimation

This paper reports an inexpensive method for stiction suppression in MEMS devices using the sublimation of camphor. Suspended microcantilever structures which would otherwise collapse to the substrate due to stiction, were successfully released using this method. The technique uses deposition of camphor nanoparticles acting as temporary supports under suspended microstructures using an immersion process. The sample is then dried, and the camphor sublimates under heating, preventing device failure due to capillary forces. This new method does not require any specialized equipment or additional processing steps; therefore, it is simpler and more economical than alternate conventional release methods.