Thermal Analysis of 2.5D Package in High Power Application

Thermal analyses have been conducted on 2.5D package in high performance application. 3D simulation model with heat sink and air fan for forced convection cooling has been constructed in limited device space. Thermal effects of heat sink length, material, and fin pattern have been investigated and compared. With 80cm air fan, a heat sink of length 120mm and width 80mm, with Cu base and Al fin array structure Type A demonstrates higher heat removal capability. Package heating power of >100W can be dissipated, while maintaining all chips under temperature limit, suggesting the developed 2.5D package integrated with multiple chips can be used in the high power application.