Novel Applications of Vertical Via in MMCM Interconnection

In the high density microwave multi-chip module (MMCM), external interconnection between components and internal interconnection between layers affect the performance, size and cost of MMCM directly. One of the challenges is to solve the problem of parasitic parameters. In this paper the parasitic parameters of via in the LTCC circuit board are used to match the structure of gold wire bonding innovatively, which results in better matching performance, smaller size and wider working frequency bandwidth. Besides, by combining the via and DGS, the performance of buried stripline could be debugged externally.