Reduction of IC Heatsink Radiation by Optimization of Absorbing Material Geometry

Absorbing materials are widely used in the field of Electromagnetic Compatibility (EMC) for reducing the radiation from IC heatsinks on printed circuit boards (PCBs). Their use and specifically the selection of absorber type and its volume directly affect the assembly costs whenever the PCB does not meet the required emission limits. The analysis carried out in this paper aims at deeply analysing the impact of material type and geometry to identify the best absorber type and geometry (and thus, its volume) to minimize the costs of such solution. Several combinations of materials and geometry are investigated using a full-wave simulator and the results are clearly summarized, thereby providing the end-user a quick way to select the appropriate absorber based on the required emission reduction.