Identification of Vulnerability Within Front-Ends Chips Using 60 GHz Near-Field Injection

Following our previous demonstration of the effects of strongly out-of-band electromagnetic interferences on RF front-ends, an extended analysis is conducted on many chips. Rules of thumb are provided as a function of three parameters (frequency of operation, electronic function, package type) and a first explanation is given on the failure mechanism owing to simulations. Furthermore a care inspection is provided by raster-scanning of the chip surface allowing the identification of vulnerability areas. We focus here on this new methodology applied to commercial chips for which the exact layout remains unknown.