Study on Warpage of Fan-Out Panel Level Packaging (FO-PLP) Using Gen-3 Panel

In this study, fan-out panel level packaging (FO-PLP) technology using redistribution layer (RDL) first approach is demonstrated using Gen-3 glass substrate (550mm × 650mm size). Investigation on panel level warpage during process is carried out through finite element analysis (FEA) to address warpage issue with considering material selection, structure design and process optimization. Taguchi method helps to identify important parameters for each process and then further parametric study is conducted with detailed FEA simulation. The effect of gravity on panel warpage has been simulated and analyzed by considering panel process and panel size. Modelling gravity effect reduces panel warpage significantly, which is much close to the real case and need to be considered in the large panel warpage simulation.