Innovative Flip Chip Package Solutions for Automotive Applications

Recently, the electronics industry is moving maturely on the mobile/tablet market. With the aggressive demand on self-driving car, the next fast growing market will be Automotive in the near future. Advance technology/packages are needed to provide ideal solutions for reliablitly and high electrical performance. Multi-function integration is also one of the critical requirements. To approach these requirements, innovative packages including Flip Chip Chip Scale Pakcage (FCCSP) and Flip Chip Ball Grid Array (FCBGA) are the potential solutions. A key components of self-driving car are radar systems that basically detects the distance and the relative speed of the vehicles. In this paper, a FCCSP device was demostrated for the 77-GHz automotive radar application. To achieve low signal loss on the high frequency (77-GHz), coreless substrate and low dielectric tangent material were implemented, the impact of substrate trace routing and laser via design were also simulated and discussed. FCCSP could provide a cost-effective, reliable package solution for 77-GHz automotive radar systems. Advance FCCSP and FCBGA also are the solutions to meet the increasing preformance requirements for the infotainment and Advanced Driver Assistance Systems (ADAS) applications in car. 2.5D IC is a platform for monoor multi-functional integration. CPU, GPU, DRAM and main-broad might be all shrunken into one chip package. 2.5D IC is also a solution of high bandwidth, small form factor and multi-function integration. In this paper, another FCCSP device was demostrated for the power managerment system in car. Another FCBGA device with copper pillar bump also was developed, it not only provides the high computing performance but also passed the Automotive related qualification and is under production. Finally, this paper will sum up the progress of advanced Flip Chip packages-FCCSP and FCBGA for the Automotive applications