Numerical Analysis of the Influence of Polymeric Materials on a MEMS Package Performance Under Humidity and Temperature Loads

The rapid expansion of the Internet of Things (IoT) and consumer electronics is driving the demand for microelectromechanical systems (MEMS) in the area of wearables, smartphones, and home and building applications. MEMS sensor packages feature a variety of polymeric materials which can significantly affect their behavior under environmental loads as humidity or temperature. A broad range of different polymeric materials can be applied in the packages, but to get a good MEMS sensor performance, an optimized application tailored material combination should be applied. To analyze the effect of the applied material types an advanced simulation approach has to be considered. A hygro-thermo-mechanical simulation based on measured temperature and moisture dependent material properties is presented. As MEMS sensor packages are complex multimaterial systems, the main challenge is the modeling of the moisture discontinuities in the interfaces. The discontinuity of moisture concentration has been solved by using the solubility approach.