Reliability of Micro-Alloyed SnAgCu Based Solder Interconnections for Various Harsh Applications

In this study, the reliability of doped solder pastes on 15mm BGA under various accelerated tests was investigated. The primary goal is to compare the solder paste performances under different tests, and ultimately, find a manufacturable solder paste that will demonstrate better reliability under different harsh applications. A total of four tests (thermal cycling, thermal shock, vibration, drop) were conducted on 15mm CABGA208 with three doped solder pastes (Innolot, CycloMax, Ecolloy) and one baseline solder paste SAC305 in order to understand the effect of doped solder paste on conventional packages. Test vehicles were built based on the types of test, and two designs were applied, one for thermal cycling, and another for mechanical cycling. Test vehicles were subjected to the corresponding test conditions with different devices to access the solder paste performances. It was found that Innolot solder paste performed better in thermal cycling, and SAC305 and Ecolloy solder pastes performed better in mechanical cycling.