Enhancing Efficiency of Antenna-in-Package (AiP) by Through-Silicon-Interposer (TSI) with Embedded Air Cavity and Polyimide Dielectric Micro-Substrate

A compact antenna is designed as a CPW fed monopole with T shape, Y shape and meander shape. Based on the larger range of the adjustable parameters of this antenna, the optimized antenna is relative compact with high radiation performance. In order to enhance the radiation performance of the antenna-in-package, an antenna-in-package based on through-silicon-interposer with embedded air cavity and polyimide dielectric micro-substrate is proposed. The shielding structure is covered among the RF device to reduce the influence of the electromagnetic interference of the AiP. Under this design, the radiant efficiency is enhanced more than 10% compared with the Si substrate antenna within large bandwidth and gain.