Influence of various micro channels integrated in PDMS module on the cooling of power chip

This paper introduces a new application of using various microchannels integrated in PDMS (Polydimethylsilox-ane) structure as a new solution for cooling in Power amplifier circuits. This paper examines in detail the distribution and flow rate analysis of coolant inside PDMS structure with different micro channels on the heat dissipation of the amplifier chip. Three different micro channels integrated in PDMS structure and the power amplifier with thermal vias were designed, simulated and analyzed. It was applied various widths, depths and quantities of micro channels under the power amplifier for improving cooling effect. The impact of various micro channels on the highest temperature of power amplifier chip was simulated in the simulation software Star-CCM+. The ground and thermal vias of the power amplifier circuit are in direct contact with the liquid coolant. The heat transfer is characterized by the decrease of maximum working temperature, temperature distribution, and flow velocity. This cooling concept improves the homogeneity and effectivity of heat transfer between the chip and the coolant and avoids the limit of rigidity of the traditional heat transfer structure.