Thermal and Electrical Properties of Room Temperature Curing Epoxy Resin Modified with Hydroxyl-terminated Nitrile Rubber

Epoxy resin, a brittle material, is a widely used thermosetting material, and one of the mature methods to toughen it is to use liquid rubber. Which can not only improve the mechanical properties of epoxy matrix, but also change other properties of epoxy matrix. In this paper, hydroxyl-terminated liquid Nitrile Rubber (HTBN) is used to modify a kind of room temperature initially-cured epoxy resin. The size of the rubber particles becomes larger as the content of HTBN increases. The rubber particles formed by HTBN reduce the crosslinking degree of the epoxy resin matrix, resulting in a small decrease in the glass ring transition temperature of the composite. Meanwhile, the rubber particles hinder the conduction of phonons, so that the thermal conductivity and thermal diffusivity of the composite material are reduced, but the reduction range is small. At the same time, the rubber phase introduces two polarization relaxation processes into the matrix, causing the relative permittivity and dielectric loss to increase abruptly at low temperature and low frequency.