Accurate Modeling Method of LGA Package for High Power Application

Accurate characterization of package electrical behavior is critical to be able to achieve optimal performance and cost targets. This paper deals with an accurate modeling methodology to simulate DC resistance for LGA package type. The core power (VDD) and core ground (GND) are design in the substrate. Each net have a big exposed pad on the bottom layer. To implement the equal potential surface on the LGA pad is a tricky problem. Therefore, this paper proposed PKG-on-PCB solution to make the equal potential surface on the LGA pad. This structure could obtain more reasonable resistance distribution. That is an accuracy modeling methodology for high power application and good to judge the package design quality.