Packaging Considerations for Integration of mm-Wave Phased Array Antennas

Although mm-wave phased array antennas can be well integrated with other parts of the circuit (e.g., chip package) due to compact size, they are more sensitive to device-level implementations. This paper reviews different possible integrations, and investigates some of the far-field effects due to device-level implementations. Experimental studies and comparisons are presented for an end-fire phased array antenna at 60 GHz unlicensed frequency band.