Considerations Regarding Computer Aided Design of a Structure to be Manufactured in Occam Technology

There are 10 years since the enunciation of a new electronic manufacturing technology that no longer uses soldering alloy, Occam technology. The new technology comes with significant changes in the way the electronic modules are made because two processes - the fabrication of the printed circuit board and the assembly of the electronic module are replaced by a single one. While there are documented several approaches of the domain from the technologist's point of view, there is not known any document about the designer's point of view, except for some hints from the promoter of the new technology. This paper is focused on the problems that the new approach of realizing the electronic module brings to the designer of the interconnection structure. Since we usually are using Altium Designer as computer aided design software, we investigated what changes occur when designing for Occam technology. The primary change is in the PCB Library where all the land patterns should be smaller. It is expected to get a better understanding of the process and to generate new rules for the designers, as well as for electronic components manufacturers.