A Novel Approach for Broadband High Frequency Interconnect Between Substrates

Micro vertical interconnect technology is one of the core technologies in board-level 3D integration system. This paper proposes a novel interconnect scheme for broadband high frequency between substrates. In this interconnect system, a miniature coaxial cable is inserted into a trench of a coplanar transmission structure. The trench makes electrical contact between the coaxial cable and the coplanar transmission line which fabricated on a PCB substrate. The size and electrical properties of the interconnect system are designed by 3D electromagnetic simulation and optimization. For comparing and analyzing the influence of corresponding fabrications, various practical samples are processed and tested. The simulation and test results verified that it has good electrical performance. The proposed approach has the advantages of small size, easy assembly and maintenance, which has a wide of application prospects in system integration and miniaturization design of RF/microwave circuits.