Robust Temperature and Humidity Dependent Electrical Package Material Characterization

Increasing high speed data rates for digital signaling and emerging technologies such as 5G have expanded the frequency range of interest for package dielectric materials characterization and generated interest in characterization over use conditions such as temperature and humidity. In this paper, a robust dielectric material characterization metrology with high repeatability under different temperature and humidity conditions is presented. Temperature and humidity dependent interpolation of material properties based on measured data is also presented and shown to provide good estimates for environmental conditions not in the original data set.