Reliability of High Density Wire Bonding in X band T/R Module

Wire bonding technology has been widely used in X band T/R module, and its reliability directly determines the RF characteristics and lifetime of T/R module. The reliability of wire bonding is greatly influenced by the surface quality of bonding area. In this paper, comparative study of different T/R module cleaning process such as anhydrous ethanol, plasma cleaning on the reliability of the wire bonding was carried out. Meanwhile, laser cleaning was also studied as a new process. It was found that the tensile strength of wire bonding after laser cleaning was improved by about 90% compared with that using traditional cleaning process.