Reliability Optimization of a 3D Packaged Micro-machined Wind Sensor

A new packaging structure is presented in this paper. It makes up of a silicon chip with four thermistors and a ceramic substrate for cover, the silicon chip is Au-Au bonded to the ceramic. Basing the operation mechanism of the micro-machined wind sensor, it will be enduring high working temperature. The target of our work is reliability evaluation and optimization of the whole packaging.Four kinds of bonding structure between the silicon chip and protection substrate are investigated for comparing the thermal mismatch stress generated by the packaging structure. Besides the parameter of the trenches designed in silicon chip are also optimized to enhance the output voltage of the micro-machined sensor. The simulation proves the stress can be decreased by 45% by using the good design compared with other bonding structure. The sensor performance can further improve by about 29.37% than without trenches.