Cyanate Ester/Epoxy Co-Curing System with Thermal Stabilizers for High Temperature Stability

With the development of next generation high power electronic devices, high temperature stability requirements of packaging materials are becoming more stringent. Therefore, demands for high performance epoxy molding compounds (EMCs) are ever increasing. EMCs are widely used as electronic packaging materials for their excellent properties, such as strong adhesion and good chemical resistance. However, EMCs generally fail under high temperature and exhibit degradation of properties due to thermo-oxidative aging. Incorporation of cyanate ester into epoxy system significantly increases the glass transition temperature and thermal stability of epoxy matrix for EMC. In this study, antioxidants are added into cyanate ester/epoxy co-curing system as thermal stabilizers to alleviate the thermo-oxidative degradation. The effects of two different phenol antioxidants are evaluated.