Reliability Test of Organic Substrate Processed by Newly Desmear Method "PhotodesmearTM"

The uses of the semiconductor increase by the development of Internet of Things. Miniaturization of the semiconductor wiring to bring speedup, electric power saving advances, and various technologies are developed. The new technology that applied a semiconductor production technology is waited eagerly for the production of the printed circuit board and semiconductor packaging. We presented new desmear process ""Photodesmear"" using vacuum ultra violet light in ECTC2016 Orlando. After the micro via formation with the laser, the smear is effective to remove a smear remaining behind in via bottom by Photodesmear. Furthermore, we improved adhesion between copper metal and epoxy resin in a sputtering seed together. We made the large experimental tool that Photodesmear could process an actually size of the print circuit board by static irradiation. And we proved that handling of panel size was technically possible. The connection reliability of the contact via is evaluated after electric copper plating by quick via peel examination. We made a cross section sample of the via, and about the smear removal properties of wet desmear processing and the Photodesmear processing, was compared with the residual smear and the oxidation thin layer by the observation of the connection interface. The interfacial surface state after the desmear processing was analyzed in X-ray probe analyzer. We produced the test vehicle using Photodesmear technology and a sputtering seed technology. We compared it with the same pattern sample produced by a process conventionally. In this paper, we report the result of the reliability test (high accelerated temperature and humidity stress test).