Transient Liquid Phase Sintering Using Copper-Solder-Resin Composite for High-Temperature Power Modules

Transient liquid phase sintering (TLPS) using copper (Cu)-solder-resin composite was investigated for dieattach applications of high-temperature power modules. The copper particles were connected with Cu-Sn IMCs through transient liquid phase reaction at about 220 °C. The Cu-IMC skeleton structure was partially filled with polyimide resin. The joint strengths of die-attached specimens were tested. The die-attached specimens showed superior reliability through thermal cycling tests. These results indicate the potential of TLPS using Cu-solder-resin composite for power module dieattach applications.