Overview of ALD applications for advanced CMOS technology

Atomic Layer Deposition (ALD) is being used for many applications in advanced CMOS technologies, e.g. hi-k materials as gate dielectric, metal materials as metal gate electrode, dielectric spacers for self-aligned double patterning (SADP) or quadruple patterning (SAQP), and metal materials as Cu diffusion barrier layer etc. Beijing NAURA Microelectronics is the largest Chinese semiconductor equipment vendor. Its products cover many IC manufacturing fields, e.g. Etch, PVD, CVD, Furnace, and Cleaning etc. With the growing Chinese semiconductor market, NAURA expends its business into ALD field and develops ALD tools and processes to meet its customers' requirements. In this paper, we are going to review the ALD applications in advanced CMOS technologies, and discuss the ALD solutions which NAURA is capable to offer in advanced CMOS technologies.