CHS application on 3D novel high-bandwidth signaling

Crosstalk is a significant problem that affects the design of interconnect between chips on a printed circuit board (PCB). It limits data rates and routing densities that are needed to fulfill the demand for smaller platform sizes at higher bandwidth. Differential signaling is one of the traditional methods to mitigate crosstalk but requires more traces per signal channel compared to single-ended signals. Crosstalk equalizer or eigen-mode signaling is a relatively new approach but is not favorable due to higher cost, higher power consumption and a more complex design. A new method presented here called “Crosstalk Harnessed Signaling” (CHS) is a promising choice to mitigate crosstalk that offers many advantages compared to the existing methods. The goal of this research is to maximum both dense routing between packages on PCBs as well as bus bandwidth per unit volume all in a small form factor at high data rates that is based on the CHS concept. Therefore, CHS 3D Novel routing is here being introduced. It offers more than 10X the cross-sectional density and bandwidth gains of up to 31X for a 4-layer matrix at DDR4 4266 compared to traditional binary signaling. The advantages of 3D CHS routing over 2D CHS routing has also been demonstrated by this research further showing the potential to maximize bandwidth per unit volume.