Evaluation of thin film encapsulation strength for commercial packaging

In this study, thin film encapsulation (TFE) strength is evaluated, whether it can withstand the force required for basic system level integration such as compression molding process, flip-chip bonding process, drop test etc. TFE withstood 100 MPa pressure, while TFE started cracking on the application of 200 MPa pressure. The following tests were performed on the TFE to qualify its suitability for normal packaging: (i) Vacuum sucking test, (ii) drop test, and (iii) compression molding.