Reliability evaluation of small-sized power device with low thermal resistance structure

In this paper, we proposed a new small-sized power device. In the structure of the proposed device, the semiconductor chips are mounted vertically and both top and bottom surfaces of the device are cooled. By applying such a structure, it was shown that miniaturization can be realized without spoiling thermal characteristics. Furthermore, the thermal response characteristics of the proposed device under motor driving condition were evaluated. As the results, we confirmed that the proposed device has sufficient long term reliability.