Differential integrated crosstalk noise (ICN) reduction among multiple differential BGA and Via pairs by using design of experiments (DoE) method

The integrated crosstalk noise (ICN) has been wildly used as an alternative to the insertion crosstalk ratio (ICR) for channel crosstalk evaluation in the IEEE 802.3ba standard. In this work, a differential ICN analysis is performed for several configurations of package-to-PCB transitions. Using the design of experiment (DoE) statistical method, differential ICN is quickly estimated for various input factors such as pin mapping, physical dimensions, and level of shielding. Optimization guide line is proposed to maintain the tradeoff among the differential ICN, design space, and manufacturing cost.