High reliable wire bonding consistency control in MMCM

Wire bonding technology has been used extensively in making electrical connections of MMIC and ASIC in multi-chip modules (MMCM), microwave characteristics of MMCM is influenced directly by the wire bonding consistency. The equivalent circuit model of wire bonding was analyzed in the paper, factors influencing wire bonding consistency in MMCM were studied, the result indicated the factors influencing wire bonding consistency are wire diameter, wire length, wire height, and the factors influencing wire bonding reliability are bonding materials, bond parameters, and bonding surface quality,. Gold wires were bonded with good stability and consistency, with proper bond parameters, wire diameter, wire length and wire height, which can meet the needs of gold wire bonding used in MMCM.