Study on the solder joint reliability of plastic ball grid array package for high reliability application

Electronic components continue to high reliability, high performance, multi-functional, miniaturization direction. High-density integrated ball grid array (BGA) surface assembly technology is widely used in the field of microelectronics packaging. In this paper, the crack failure behavior of plastic ball grid array (PBGA) is studied under mechanical vibration load. The stress - strain distribution of PBGA solder joint under random vibration load condition is analyzed by ANSYS finite element simulation method. The test results show that the PBGA surface is the furthest from the center of the diagonal corner of the first crack occurred cracking failure. The cracking of the solder joint extends inwardly from the diagonal of the device, and the location of the solder joint is generally at the interface between the device pad and the solder. The results of finite element simulation show that the stress and strain of the external end edge of the joint surface of the solder joint and the PCB substrate are the most likely to crack and the fatigue failure of the solder joint. The results of finite element simulation analysis are inconsistent with the reliability test results. It is necessary to optimize the design of the package structure, the process parameters to optimize.