A universal structure for self-aligned in situ on-chip micro tensile fracture strength test

This paper presents a universal self-aligned in situ on-chip micro tensile fracture strength tester designed for tensile strength extraction and process evaluation, which will provide, for the first time as far as the authors know, great force(above 100mN) to in situ on-chip specimen without the introduction of precise instrument, especially suitable for bulk micromachining related tests. The whole structure and process is simple, so it meets the requirements of various process in massive production, the feasibility and universality have been proved by practical evaluation of the several foundries. Its advantages also include self-position, self-measure and self-adaption for loading. In our tests, tensile fracture strength of the etched Si film is between 0.13 to 1.2GPa.