A novel flexure-based XYθ motion compensator: Towards high-precision wafer-level chip detection

In order to solve the conflict between large stroke and high precision for positioning systems in the chip packaging area, macro/micro composite positioning strategy is an effective strategy. This paper presents the development of a flexure-based XYθ compensator that can generate end-effector motion in the range of around 100 μm and with sub-nanometer resolution; in particular, a parallel configuration that generates a planar XYθ motion is considered. The contribution of this paper is that a novel XYθ 3-DOF flexible micropositioner is proposed, which has a larger stroke than the classic one. After a series of mechanistic optimal designs, the performance of the designed nanopositioner is verified by using the Finite Element Analysis (FEA) method. The experimental results indicate that the mechanism displacement amplification ratio can reach up to 3.8, thus the maximum output displacement can achieve around 0.144mm.