Hybrid substrate structure for readily stretchable and highly reliable electronic circuits

We propose a new hybrid structure of the substrate for fabricating stretchable electronic circuits, which provides well-controlled wavy and stretchable regions for interconnects and flat and rigid areas for active devices, respectively. In this technique, the thick-and-flat polyimide islands for active devices are formed within a thin-and-wavy parylene region for stretchable interconnects, so that most external strain can be accommodated solely by the deformation of the interconnecting area. Based on conventional processes completely compatible with existing flexible circuit technology, the present technique is desired to be readily applicable for practical stretchable circuits.