Fast analysis and implementation of microelectronic packaging MSL with equal moisture distribution method

With the rapid development of electronic packaging product design and manufacture, it is one of most concerned problems that how to provide reliable products to the market. One of the most time-consuming problems in the reliability analysis of microelectronic packaging is the problem of conventional heat and humidity sensitivity analysis. The non hermetic package in the microelectronic packaging is affected by the heat and humidity environment, which will lead to the failure during soldering reflow, which seriously affect the microelectronic packaging and assembly. The international electronics industry standardization organization makes a considerable number of standards for heat and humidity problem. But the experiment time is too long and time consuming. Therefore, how to shorten the time of conventional analysis becomes extremely important. This study will establish a new method equal moisture distribution at different pre-conditioning. Different temperatures, different humidity conditions will result in different water saturation and diffusion coefficient. The parameters of the other conditions can be obtained by using the derived formula. According to the requirements of the project, The SOP package is chosen as experimental devices, with the thickness of 1.4mm. Constant temperature and humidity test chamber, reflow soldering machine, ultrasonic microscope SAM300 and electronic balance are used in our experiment instrument. ANSYS software is used to model the structure of the package, such as EMC, underfill, copper and die attach, which are used in the package. Using the finite element method, the distribution of moisture absorption at different pre-conditionings are compared. And 2 to 5 acceleration factors are obtained.