Foreword: Silicon systems for the Internet of Everything

It is my pleasure to welcome you to the 63rd International Solid-State Circuits Conference. The Conference continues its outstanding tradition of showcasing the most advanced and innovative work from industry and academe around the world, in the area of integrated circuits and systems. This year, the geographical distribution of the accepted technical papers reflects the truly international character of the Conference: 42% of the accepted papers are from North America, 34% are from the Far East, and 24% are from Europe. Of these papers, 53% are from academe, 39% are from industry, and 8% are from institutions/labs.