Laser-Induced Forward Transfer-assisted flip-chip bonding of optoelectronic components

In this paper, the first results of Laser-Induced Forward Transfer (LIFT)-assisted printing of micro-bumps of non-flux based silver nanoparticle (AgNP) and flux-based solder pastes for flip-chip bonding of optoeletronic components were reported . The successful demonstration of chip-bumping and bonding with AgNP and solder pastes using LIFT shows the great potential of the technique for flip-chip interconnect technology especially for applications requiring fine pitch and high accuracy.