Silicon solutions for RF front-end applications

The 4
^th
generation wireless standard is ushering an era of ubiquitous connectivity. The convergence of data and voice to a portable media device is producing an explosive demand for high data rate communication. Such convergence requirements along with the need for improved battery life, smaller form factor, and reduced cost will demand new ways of system integration. The RF front-end-modules (FEM) that incorporates Power Amplifiers (PAs), Switches, power controller, and passives is one of the segment that is seeing major advancements. Silicon solutions are starting to penetrate into this GaAs stronghold. We discuss the potential for silicon-based technology in providing capability for FEM integration.