The polymer materials as the essential input parameters in numerical multi-objective optimization of stacked packaging

For the recent years, there is an outstanding progress in many microelectronic fields. One of the techniques which is nowadays widely used in microelectronics (and not only) is numerical prototyping. This technique has rapidly evolved because of the development of faster microprocessors and RAM modules which improve and speed up the calculations and optimization algorithms. The large development of electronic market can be mainly noticed today in fabrication of mobile devices (mobile phones, MP3 Players, PDA’s, digital cameras) in which the main advantage is due to small geometrical dimensions and multi-functionality. One of the solutions which lead to such features is the 3D Packaging. Nevertheless there is a number of problems that need to be solved. In volumetric devices such as stacked packaging the problem of heat abstraction may exist more often. The thermal changes can cause stresses in a package which may lead to cracking, delamination and other damages. It has been observed that the polymer materials used in electronic packaging play the crucial role in the reliability. The damages can be therefore minimized by optimizing the polymer layers. In this paper such approach is carried out in reference to 3D stacked package.