Abstract:
We demonstrate a photoplastic NEMS device that has an encapsulated polysilicon piezoresistor. The crucial temperature limitation of depositing a polysilicon film on a pol...Show MoreMetadata
Abstract:
We demonstrate a photoplastic NEMS device that has an encapsulated polysilicon piezoresistor. The crucial temperature limitation of depositing a polysilicon film on a polymer was overcome by employing a novel Hotwire CVD process. In this paper, we report the fabrication and characterization of a novel polymeric cantilever with an embedded piezoresistor, which exploits the low Youngs modulus of a polymer and high gauge factor of polysilicon. Such devices are widely used for sensing biochemicals.
Published in: 2008 8th IEEE Conference on Nanotechnology
Date of Conference: 18-21 August 2008
Date Added to IEEE Xplore: 03 September 2008
ISBN Information:
Print ISSN: 1944-9399
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