Photoplastic NEMS with an Encapsulated Polysilicon Piezoresistor

We demonstrate a photoplastic NEMS device that has an encapsulated polysilicon piezoresistor. The crucial temperature limitation of depositing a polysilicon film on a polymer was overcome by employing a novel Hotwire CVD process. In this paper, we report the fabrication and characterization of a novel polymeric cantilever with an embedded piezoresistor, which exploits the low Youngs modulus of a polymer and high gauge factor of polysilicon. Such devices are widely used for sensing biochemicals.