IPFA 2008 table of contents

The following topics are dealt with: high-performance CMOS; advanced IC packaging; IC package reliability evaluation novel ESD device structure; BEOL metallization reliability; device package failure analysis; silicon nMOSFET characterisation; silicon pMOSFET characterisation; multisource/drain SOI MOSFET simulation; solar cells; memory cells; semiconductors physical characterization; semiconductors chemical characterization; advanced low-k interconnects; passive RFID tags; and nanowire FinFET hot carrier degradation.