IEEE Transactions on Component Parts

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  • Application of the Eyring Model to Capacitor Aging Data

    Publication Year: 1965, Page(s):34 - 41
    Cited by:  Papers (66)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1248 KB)

    The Eyring Model has been used to derive the "power rule" for capacitors. Analytical models for evaluating progressive and step stress tests are presented. Various methods are discussed for determining the value of the exponent for the power rule. In particular, the relation between the exponent of the power rule and the beta of the Weibull distribution, for both progressive and constant stress te... View full abstract»

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  • Hysteresis Loop Analysis

    Publication Year: 1963, Page(s):115 - 118
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (512 KB)

    The apparent hysteresis loop of a square loop magnetic material is affected by winding capacitance, shorted turns, air gap, and strain. The effects of these parameters on an oscilloscopic display of the dynamic hysteresis loop are demonstrated. View full abstract»

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  • Inductor Size vs. Q: A Dimensional Analysis

    Publication Year: 1963, Page(s):31 - 35
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (608 KB)

    Equations are derived and curves are plotted showing the change in Q of an inductor as a function of a change in size. The approach used is to assume the existence of a model having a fixed inductance and operating under a fixed set of conditions. A change in size is introduced by a magnification-type enlargement or shrinkage of all outline dimensions by the factor "a." Assuming a constant effecti... View full abstract»

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  • Life Performance History of Minuteman Design Dipped Mica Capacitors

    Publication Year: 1964, Page(s):352 - 357
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    This paper describes the early reliability investigation program conducted on regular production El-Menco dipped mica capacitors and covers a report containing an analysis of the raw data resulting from this reliability study. Discussed are the results of a reliability verification program performed on initial production Minuteman design dipped mica capacitors, and the unit-hours accumulated as a ... View full abstract»

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  • Thin Films of Titanium and Titanium Oxide for Microminiaturization

    Publication Year: 1964, Page(s):38 - 47
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (992 KB)

    Experimental results on the electrical properties of thin-film resistors, thin-film capacitors and thin-film diodes made of titanium/ titanium oxide/metal layers are described. The conduction phenomena in the three-layer titanium/ titanium oxide/metal structure are explained on the basis of a p-n Junction and p-i-n junction within the anodically formed oxide films. View full abstract»

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  • Application of Capacitors in Low Frequency and Long Time Constant Circuits

    Publication Year: 1964, Page(s):216 - 219
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (456 KB)

    This paper discusses the low frequency (less than 1 cps) and long time constant applications and testing of capacitors as used in analog control systems. Emphasis is placed on tantalum electrolyric types, as they provide the necessary volume efficiency for airborne systems. The effective capacitance is always larger at the low frequencies than at normal capacitance bridge measuring frequencies. Th... View full abstract»

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  • Fluorescence and Phosphorescence

    Publication Year: 1964, Page(s):3 - 7
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (760 KB)

    A brief survey of fluorescence and phosphorescence in inorganic luminophors (phosphors) is presented. This includes a short discussion on the preparation and composition of phosphors, the role of the matrix, and a discussion of activators, charge compensators, and flux. The nature and significance of absorption and emission spectra are discussed. A general model of the mechanism involved in excita... View full abstract»

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  • A Critical Evaluation of Tantalum Nitride Thin Film Resistors

    Publication Year: 1964, Page(s):86 - 96
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1104 KB)

    An extensive evaluation program has been carried out on newly developed tantalum nitride thin film resistors that were specifically prepared for this purpose and which included several levels of four manufacturing variables, namely substrate material, film thickness, line width and anodizing voltage. Resistors were subjected to a series of non-destructive screening tests followed by severe environ... View full abstract»

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  • Industrial Adaptation of the Time Dependent Failure Rate

    Publication Year: 1964, Page(s):274 - 278
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (544 KB)

    The time dependence of the failure rate of electronic parts and equipments has been strongly evidenced by recent data. Information is cited which reveals that for many devices failure rate not only is time dependent but is an inverse time function, i.e., decreases as time increases. The possibility that this property is inherent in many other parts and systems is hypothesized. The electronics indu... View full abstract»

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  • A New Approach to the Attainment of the Highest Possible Reliability in Tantalum Capacitors

    Publication Year: 1965, Page(s):21 - 29
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1488 KB)

    The question of how to achieve the highest possible reliability for Tantalum capacitors is discussed from both the theoretical and practical point of view. A method of achieving reliabilities of the order 95 per cent at a confident level of 95 per cent or better is described which involves an analytical treatment of the physics of the main mode of failure, all accounting for over 90 per cent of a ... View full abstract»

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  • A Report of the Proposed IEEE Test Procedure for the Evaluation of Insulation Systems for Electronic Power Transformers

    Publication Year: 1964, Page(s):279 - 289
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1000 KB)

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  • Resins for Embedding Microelectronic Devices

    Publication Year: 1964, Page(s):22 - 27
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (928 KB)

    This paper discusses the use of liquid resin systems for potting, casting or encapsulating microelectronic devices. Subject matter includes discussions on epoxies, silicones, polyurethanes, polyesters and thermosetting hydrocarbons and their modifications. Discussed in detail are the large number of modifications possible in epoxies using a variety of curing agents, flexibilizers and diluents. The... View full abstract»

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  • The Optimization of Square-Law Elements Based on Silicon Carbide Nonlinear Resistors

    Publication Year: 1965, Page(s):3 - 7
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (664 KB)

    A segmental square-law circuit is described employing silicon carbide nonlinear resistors in a parallel configuration analogous to a conventional diode function generator, but having the advantage of requiring no bias supplies and giving an output noticeably free of discontinuities. An optimization procedure is described by which satisfactory values for the circuit elements were obtained. Using on... View full abstract»

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  • Substrates for Thin-Film Circuitry

    Publication Year: 1964, Page(s):15 - 22
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1456 KB)

    The properties of available glass, ceramic and other substrate materials are reviewed in the light of requirements imposed by current practice in thin-film circuitry. Special substrate glasses and glazed high thermal conductivity ceramics appear to be best suited to the majority of applications. Techniques for evaluation of the smoothness of substrate surfaces are reviewed and procedures for clean... View full abstract»

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  • Electronic Component Parts Failure Rates and Failure Mechanism Research in the United Kingdom

    Publication Year: 1964, Page(s):333 - 351
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2120 KB)

    Failure rates have been collected at the Royal Radar Establishment since 1944 and continuous records of failures in radar equipments undergoing environmental testing have been maintained. The effect of environment on failure rates was investigated as early as 1945 and M.T.B.F's of 116 hours in England and Europe, 61 hours in the Mediterranean and 18 hours in the tropics were obtained in that year.... View full abstract»

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  • Design of Synthetic Circuit Elements

    Publication Year: 1964, Page(s):330 - 332
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (264 KB)

    The availability of solid state operational amplifiers makes possible the design of quite compact synthetic circuit elements. These operational amplifiers can be used to implement negative impedance conversion, as well as the synthesis of inductance, capacitance, and resist- ance. View full abstract»

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  • Fabrication and Reliability of Thin Film Crossovers and Terminations

    Publication Year: 1964, Page(s):48 - 53
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (662 KB)

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  • Industrial Sapphire - A Key to Reliable Microelectronics

    Publication Year: 1964, Page(s):120 - 128
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    The reliability of evaporated thin films of nichrome 1OO to 2,000 angstroms in thickness when deposited onto a ceramic substrate can be related to the physical and electrical properties of the substrate. Through careful selection of materials that are physically and electrically compatible with these extremely thin films, reliability and volumetric efficiency of precision film resistors can be mat... View full abstract»

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  • ML-1 Capacitors. A New, Miniaturized Type of Plastic Film Capacitor

    Publication Year: 1964, Page(s):205 - 211
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (584 KB)

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  • A Miniature Variable Capacitor

    Publication Year: 1964, Page(s):220 - 224
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (696 KB)

    A two-section variable capacitor of novel design has been developed for use as a tuning element in a microelectronic superheterodyne receiver. The device consists of a ganged oscillator and RF section, both contained in a metallic cylinder 0.25 in. in diameter and 1.125 in. in length. Each section of this capacitor comprises: (1) an electrically grounded conductive screw, (2) a threaded insulating... View full abstract»

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  • Research Toward a Physics of Aging of Silicon P-N Junctions

    Publication Year: 1964, Page(s):28 - 32
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    As part of the Electronic Component Reliability Center at Battelle Memorial Institute an experimental program has been initiated, the goal of which is to develop an approach to reliability prediction based on an understanding of the physical processes responsible for degradation of performance characteristics of electronic component parts. A modification of the Eyring rate equation, accounting for... View full abstract»

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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope