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Components and Packaging Technologies, IEEE Transactions on

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.

Full Aims & Scope

Studies on Optical Consistency of White LEDs Affected by Phosphor Thickness and Concentration Using Optical Simulation

Zong-Yuan Liu ; Sheng Liu ; Kai Wang ; Xiao-Bing Luo

Dec-30 2010
Editorial - Science, Technology, and Industrial Policy

Pecht, M. G. ; Zuga, L.

Dec-30 2010
Coupled Thermal and Thermo-Mechanical Design Assessment of High Power Light Emitting Diode

Han, B. ; Changsoo Jang ; Bar-Cohen, A. ; Bongmin Song

Dec-30 2010
Electrical Contact Resistance in Thin $({\leq}{\rm 0.5}~\mu{\rm m})$ Gold Plated Contacts: Effect of Gold Plating Thickness

Misra, P. ; Nagaraju, J.

Dec-30 2010
Multiobjective Optimization of a Grooved Micro-Channel Heat Sink

Ansari, D. ; Husain, A. ; Kwang-Yong Kim

Dec-30 2010

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Dynamic lithium-ion battery model for system simulation

Lijun Gao ; Liu, Shengyi ; Dougal, R.A.

Jan-06 2003
Power and life extension of battery-ultracapacitor hybrids

Dougal, R.A. ; Liu, Shengyi ; White, R.E.

Aug-07 2002
Characterization of hygroscopic swelling behavior of mold compounds and plastic packages

Stellrecht, E. ; Han, B. ; Pecht, M.G.

Sep-03 2004
Printed organic transistors for ultra-low-cost RFID applications

Subramanian, Vivek ; Chang, P.C. ; Lee, J.B. ; Molesa, S.E. ; Volkman, S.K.

Dec-05 2005
Reliability analysis and design for the fine-pitch flip chip BGA packaging

Chih-Tang Peng ; Chang-Ming Liu ; Ji-Cheng Lin ; Hsien-Chie Cheng ; Kuo-Ning Chiang

Nov-30 2004

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Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.

More About this Journal

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.

Aims & Scope

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging; new developments in passive and integrated components, electrical contacts and connectors, bonding,interconnection, device reliability and failure modes, and materials for electronics; thermal management, including thermomechanics, thermal measurement, cooling technology, and thermal phenomena in electronics.

Persistent Link: http://ieeexplore.ieee.org/servlet/opac?punumber=6144 More »

Frequency: 4

ISSN: 1521-3331

Publication Details: IEEE Transactions on Components and Packaging Technologies

Published by:

IEEE Components, Packaging, and Manufacturing Technology Society

Subjects

Components, Circuits, Devices & Systems

Contacts

Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.
3501 Ed Bluestein Blvd., TX11/K10
Austin, TX 78721 78721 USA
rama@ieee.org
Phone:+1 512 933 2555
Fax:+1 512 933 6438

Editor-in-Chief
S.W. Ricky Lee
Hong Kong University of Science & Technology
Department of Mechanical Engineering
Clear Water Bay, Kowloon Hong Kong
rickylee@ust.hk
Phone:852 2358 7203
Fax:852 2358 1543

About this Journal

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Title History

( 1994 - 1998 ) Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
( 1978 - 1993 ) Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
( 1971 - 1977 ) Parts, Hybrids, and Packaging, IEEE Transactions on
( 1972 - 1977 ) Manufacturing Technology, IEEE Transactions on
( 1965 - 1971 ) Parts, Materials and Packaging, IEEE Transactions on
( 1963 - 1965 ) Product Engineering and Production, IEEE Transactions on
( 1963 - 1965 ) Component Parts, IEEE Transactions on
( 1955 - 1962 ) Component Parts, IRE Transactions on
( 1961 - 1962 ) Product Engineering and Production, IRE Transactions on
( 1956 - 1959 ) Production Techniques, IRE Transactions on
( 1954 - 1955 ) Component Parts, Transactions of the IRE Professional Group on

Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.

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