Advanced Packaging, IEEE Transactions on
IEEE Access
Proceedings of the IEEE
Spectrum, IEEE
Popular Articles (March 2013)
Includes the top 25 most frequently downloaded documents for this publication according to the most recent monthly usage statistics.Society Sponsor
-
-
-
-
4. A solder-free interconnect approach for integrating millimeter wave high-power devices with planar circuitry
|
PDF (1961 KB)
-
-
-
-
8. Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications
|
PDF (1344 KB)
-
-
-
-
-
-
-
15. Power distribution system design methodology and capacitor selection for modern CMOS technology
|
PDF (204 KB)
-
16. SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade
|
PDF (832 KB)
-
-
-
19. Using self-assembly for the fabrication of nano-scale electronic and photonic devices
|
PDF (668 KB)
-
20. Stress analysis in silicon die under different types of mechanical loading by finite element method (FEM)
|
PDF (525 KB)
-
-
-
-
-
HTMLAims & Scope
IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.
Meet Our Editors
Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering
