# IEEE Transactions on Components, Packaging and Manufacturing Technology

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• ### A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications

Publication Year: 2017, Page(s):964 - 973
| | PDF (2785 KB) | HTML

A 2×2 dual-polarized antenna subarray with filtering responses is proposed in this paper. This antenna subarray is a multilayered 3-D geometry, including a dual-path 1× 4 feeding network and four cavity-backed slot antennas. The isolation performance between two input ports is greatly improved by a novel method, which only needs to modify several vias in a square resonator. Cavities ... View full abstract»

• ### Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Publication Year: 2017, Page(s):1891 - 1898
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The use of additive manufacturing (AM) techniques for the fabrication of 3-D fractal monopole antennas is presented. The 3-D printing (3-D P) of 3-D designs based on the Sierpinski fractal concept is studied, and the performance discussed. The AM allows the fabrication of the complex features of these antennas. The specific structures, on the other hand, provide a reduction of the material used in... View full abstract»

• ### Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Publication Year: 2017, Page(s):1729 - 1738
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In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, reconstituted carrier material and thickness, and die-attach film, on the warpage after postmold... View full abstract»

• ### 3-D Printed Metal-Pipe Rectangular Waveguides

Publication Year: 2015, Page(s):1339 - 1349
Cited by:  Papers (27)
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This paper first reviews manufacturing technologies for realizing air-filled metal-pipe rectangular waveguides (MPRWGs) and 3-D printing for microwave and millimeter-wave applications. Then, 3-D printed MPRWGs are investigated in detail. Two very different 3-D printing technologies have been considered: low-cost lower-resolution fused deposition modeling for microwave applications and higher-cost ... View full abstract»

• ### Design of Compact Bandpass Filters Using Quarter-Mode and Eighth-Mode SIW Cavities

Publication Year: 2017, Page(s):956 - 963
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The contribution of this paper is to propose novel balanced and dual-band bandpass filters (BPFs), using quarter-mode (QM) and eighth-mode (EM) substrate integrated waveguide (SIW) cavities, for the size reduction of the overall circuit. Two balanced BPFs, which separately demonstrate a third-order Chebyshev response and a fourth-order quasi-elliptic response, are realized by properly choosing, fe... View full abstract»

• ### Improving Data Center Energy Efficiency With Advanced Thermal Management

Publication Year: 2017, Page(s):1228 - 1239
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Experimental investigation of data center cooling and computational energy efficiency improvement through advanced thermal management was performed. A chiller-less data center liquid cooling system was developed that transfers the heat generated from computer systems to the outdoor ambient environment while eliminating the need for energy-intensive vapor-compression refrigeration. This liquid cool... View full abstract»

• ### Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Publication Year: 2017, Page(s):1191 - 1205
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This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and future challenges based on discussions at the 3rd Workshop on Thermal Management in Telecommunication S... View full abstract»

• ### A Millimeter-Wave Micromachined Air-Filled Slot Antenna Fed by Patch

Publication Year: 2017, Page(s):1683 - 1690
| | PDF (2018 KB) | HTML

In this paper, a millimeter-wave air-filled slot antenna is presented based on bulk silicon microelectromechanical systems micromachining technology. The antenna is suitable for system-in-package application by utilizing this silicon micromachining technique. To achieve high radiation efficiency in millimeter-wave band, three gold-plated silicon layers are bonded together to realize an air-filled ... View full abstract»

• ### Single-Layer Broadband Phase Shifter Using Multimode Resonator and Shunt $\lambda$ /4 Stubs

Publication Year: 2017, Page(s):1119 - 1125
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This paper presents a new method for single-layer broadband phase shifter without needing any coupling structure. The phase shifter consists of a multimode resonator and two shunt λ/4 stubs. Meanwhile, the bandwidth of proposed phase shifters can be achieved more than 100%. For prescribed return loss, phase shift value, and phase error, this paper develops a synthesis approach to determine ... View full abstract»

• ### High-Frequency Characterization of Through-Silicon-Vias With Benzocyclobutene Liners

Publication Year: 2017, Page(s):1859 - 1868
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This paper presents design, fabrication, and high-frequency characterization of through-silicon-vias (TSVs) with benzocyclobutene (BCB) as the dielectric liner to exploit its low dielectric constant. Fabrication processes for BCB polymer liner TSVs are developed, and BCB-liner TSVs have been successfully fabricated in both low-resistivity silicon and high-resistivity silicon substrates for compari... View full abstract»

• ### A Novel 3-D Embedded Module for Displacement Measurement in Metal Structures

Publication Year: 2017, Page(s):1765 - 1773
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Measurements of relative displacement between the components of structural steel frameworks such as those used in large buildings, bridges, ships, and offshore platforms can be used to detect overstress or impending failure. However, current approaches used to measure displacement require complex arrays of optical sensors or strain gauges. We instead present a novel low-cost wireless 3-D embedded ... View full abstract»

• ### Electrically Controllable Composite Right/Left-Handed Leaky-Wave Antenna Using Liquid Crystals in PCB Technology

Publication Year: 2017, Page(s):1331 - 1342
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A design method for electrically controllable composite right/left-handed (CRLH) leaky-wave antennas (LWAs) with large beam-steering range employing liquid crystal (LC) in printed circuit board technology is proposed. It is demonstrated with detailed mathematical derivation that the design principle enables the LC-CRLH-LWA to keep the balanced condition with all bias states applied to the LC, yiel... View full abstract»

• ### Wearable AMC Backed Near-Endfire Antenna for On-Body Communications on Latex Substrate

Publication Year: 2016, Page(s):346 - 358
Cited by:  Papers (1)
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A near-endfire, artificial magnetic conductor (AMC) backed wearable antenna is proposed in this paper for wireless body area networks operating in the 2.4-GHz industrial, scientific and medical (ISM) radio band. The latex substrate permittivity has accurately been characterized for realizing a flexible planar Yagi-Uda antenna printed on it using a large-area screenprinting process. The bidirection... View full abstract»

• ### Design of Dual-Band Millimeter-Wave Antenna-in-Package Using Flip-Chip Assembly

Publication Year: 2014, Page(s):385 - 391
Cited by:  Papers (3)
| | PDF (2219 KB) | HTML

A dual-band antenna-in-package for millimeter-wave (mmW) applications is presented in the paper. The proposed antenna, which consists of a radiating slot and an air-filled cavity, is fed by a microstrip loaded with two tuning open-circuited stubs through a coupling C-shape aperture to achieve dual-band characteristics. The air-filled cavity, which is formed by the space between CMOS chip and integ... View full abstract»

• ### Self-Packaged, Low-Loss, Planar Bandpass Filters for Millimeter-Wave Application Based on Printed Gap Waveguide Technology

Publication Year: 2017, Page(s):1419 - 1431
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A new concept of printed planar technology is introduced for the realization of low-loss bandpass filters in millimeter band. The new technology is self-packaged, and the insertion loss shows meaningful improvement compared to microstrip (MS) filters. The designs are based on the ridge gap waveguide (RGW), which is composed of printed parallel-plate waveguide surrounded by beds of mushrooms that s... View full abstract»

• ### Frequency-Tunable Filtering Power Divider With New Topology

Publication Year: 2017, Page(s):1151 - 1162
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In this paper, we present a new frequency-tunable filtering power divider structure and its design method. For achieving the frequency filtering characteristic, the power divider uses a single resonator or multiple resonators. One of the unique features of the presented structure is that the last resonator is coupled to the two outputs, and this allows for minimizing the number of the resonators u... View full abstract»

• ### 77-GHz Automotive Radar Sensor System With Antenna Integrated Package

Publication Year: 2014, Page(s):352 - 359
Cited by:  Papers (6)
| | PDF (1449 KB) | HTML

In this paper, a 3-D integrated 77-GHz automotive radar front-end is presented. Embedded wafer level packaging (EMWLP) technology is proposed to eliminate the use of wire bonding, which not only introduces significant radio frequency loss, but also occupies large footprint for high-pin count die. The transceiver bare die is embedded in a reconfigured molded wafer with compression molding process. ... View full abstract»

• ### A Novel Two-Cap Filter for Routing Noise Suppression Using Extended EBG Analysis

Publication Year: 2017, Page(s):1852 - 1858
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This paper proposes a novel two-cap wideband filter that suppresses the high-frequency noise in a power trace routing. By combining electromagnetic bandgap (EBG) theory and decoupling capacitors, the EBG propagation characteristics are studied and a systematic design procedure is proposed. Advanced Design System (ADS) and gigahertz transverse electromagnetic (GTEM) cell measurement are used to val... View full abstract»

• ### High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Publication Year: 2011, Page(s):181 - 195
Cited by:  Papers (178)  |  Patents (2)
| | PDF (3071 KB) | HTML

We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic RLGC equations derived from the physical configuration. Each analytic equ... View full abstract»

• ### Packaging Solution for a Millimeter-Wave System-on-Chip Radar

Publication Year: 2017, Page(s):1 - 9
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In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a ... View full abstract»

• ### Novel Reconfigurable 3-D Frequency Selective Surface

Publication Year: 2017, Page(s):1678 - 1682
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A novel reconfigurable 3-D frequency selective surface (FSS) exhibiting bandstop response is proposed in this paper. The unit cell of the proposed 3-D FSS is constructed from concentric threaded cylinders. The proposed novel 3-D FSS achieves reconfigurability by sliding technique. It offers frequency tuning from 1.86 to 3.10 GHz by sliding the outer cylinder over the inner cylinder. The proposed F... View full abstract»

• ### An Effective Approach to Deembed the Complex Propagation Constant of Half-Mode SIW and Its Application

Publication Year: 2016, Page(s):109 - 116
Cited by:  Papers (1)
| | PDF (2220 KB) | HTML

In this paper, a numerical short-open calibration (SOC) method is presented to numerically deembed the complex propagation constant of half-mode substrate integrated waveguide (HMSIW). After three distinctive equivalent circuit networks are described for SOC deembedding procedures, the propagation characteristics of HMSIW can be extracted. The numerical stability and convergence are illustrated. T... View full abstract»

• ### A Universal Reference Line-Based Differential Phase Shifter Structure With Simple Design Formulas

Publication Year: 2017, Page(s):123 - 130
| | PDF (1434 KB) | HTML

The conventional differential phase shifter configurations usually require different reference lines to provide constant phase shifts over a certain bandwidth. This results in high design complexity, especially for the multiway and poly-phase applications. To solve this problem effectively, a new differential phase shifter configuration based on the parallel stubs loaded transmission line is propo... View full abstract»

• ### A Novel Two-Layer Low-Profile 23-GHz Microstrip Array Fed by Slots in an SIW for Wireless Backhauling Applications

Publication Year: 2017, Page(s):1126 - 1135
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This paper proposes a robust option for developing a new class of efficient and cheap antenna array based on patch array fed by substrate-integrated waveguide (SIW) through slot apertures for wireless backhauling applications. It consists in performing the feed network in SIW and the radiating structure in microstrip technology. The microstrip lines are coupled to the slots on the top wall of the ... View full abstract»

• ### Die Attach Materials for High Temperature Applications: A Review

Publication Year: 2011, Page(s):457 - 478
Cited by:  Papers (108)
| | PDF (3230 KB) | HTML

The need for high power density and high temperature capabilities in today's electronic devices continues to grow. More robust devices with reliable and stable functioning capabilities are needed, for example in aerospace and automotive industries as well as sensor technology. These devices need to perform under extreme temperature conditions, and not show any deterioration in terms of switching s... View full abstract»

• ### Heat-Depolymerizable Polypropylene Carbonate as a Temporary Bonding Adhesive for Fabrication of Flexible Silicon Sensor Chips

Publication Year: 2017, Page(s):1751 - 1758
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This paper presents a method for fabrication of flexible silicon sensor chips using temporary bonding, backside thinning, debonding, and flexible packaging. Flexibility of silicon chips requires ultrathin thickness, which imposes a challenge to debonding of thinned silicon chips from carrier wafers because of the fragility of silicon. To address this problem, temporary bonding using polypropylene ... View full abstract»

• ### Effects of Die-Attach Voids on the Thermal Impedance of Power Electronic Packages

Publication Year: 2017, Page(s):1608 - 1616
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Thermal runaway is among the major failure mechanisms of power semiconductor packages. Thermal dissipation of power electronics depends on the quality of the solder die-attach, any defects such as voids, and delamination-impede heat dissipation that results in hot spots that can cause thermal runaway and/or a premature device failure. Therefore, investigation of thermal impact due to die-attach de... View full abstract»

• ### Hybrid DC Circuit Breaker Feasibility Study

Publication Year: 2017, Page(s):354 - 362
| | PDF (1948 KB) | HTML

Recently, a growing number of dc systems exist based on the development of electrical energy consumption. For low-voltage dc grids, switching devices are needed that have to meet technically sophisticated requirements. These devices have to handle fault currents of several hundred amperes and system voltages up to 1000 V. A typical dc circuit breaker has to provide low on-state losses, light weigh... View full abstract»

• ### The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

Publication Year: 2017, Page(s):1583 - 1591
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In this paper, the effects of adhesion properties of anisotropic conductive films (ACFs) interconnection on the chip-in-flex (CIF) bending reliability were investigated. Oxygen plasma treatment was conducted to increase the adhesion strength between ACFs and Si chip or ACFs and flexible printed circuit (FPC) substrates. In order to characterize the enhanced adhesion properties of the CIF packages,... View full abstract»

• ### Narrow-Band Microwave Filter Using High-Q Groove Gap Waveguide Resonators With Manufacturing Flexibility and No Sidewalls

Publication Year: 2012, Page(s):1882 - 1889
Cited by:  Papers (38)  |  Patents (2)
| | PDF (1095 KB) | HTML

This paper presents a new type of narrow band filter with good electrical performance and manufacturing flexibility, based on the newly introduced groove gap waveguide technology. The designed third and fifth-order filters work at Ku band with 1% fractional bandwidth. These filter structures are manufactured with an allowable gap between two metal blocks, in such a way that there is no requirement... View full abstract»

• ### Design of Microelectronic Cooling Systems Using a Thermodynamic Optimization Strategy Based on Cuckoo Search

Publication Year: 2017, Page(s):1804 - 1812
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This paper proposes a conceptual design strategy for an optimal cooling system, typically used in several microelectronic devices. The methodology was implemented using the entropy generation minimization (EGM) criterion, powered by the cuckoo search (CS) algorithm. EGM-CS methodology was addressed to design rectangular microchannel heat sinks, utilizing high thermal conductive graphite as build m... View full abstract»

• ### Large Frequency-Ratio Dual-Band and Broad Dual-Band Parallel-Line Couplers

Publication Year: 2017, Page(s):1 - 11
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In this paper, a symmetric stepped-impedance coupled line (SSICL) is proposed to realize dual-band quarter-wave coupled line (DQCL), giving the same equivalent even and odd characteristic impedances at two different frequencies. The DQCL can be directly used to design dual-band parallel-line coupler (DBPC) with arbitrary coupling coefficient and large frequency ratio, resulting in even shorter tot... View full abstract»

• ### Independently Tunable/Controllable Differential Dual-Band Bandpass Filters Using Element-Loaded Stepped-Impedance Resonators

Publication Year: 2017, Page(s):1 - 8
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This paper presents a new approach for designing differential bandpass filter (BPF) with independently tunable/controllable dual passbands using the element-loaded stepped-impedance resonators (SIRs). The frequency-agile ability of the fundamental and third-harmonic resonant frequencies (f₁ and f₃ of the element-loaded SIR against the value of the loaded element under different loadi... View full abstract»

• ### Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling

Publication Year: 2017, Page(s):1774 - 1785
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Through-silicon via (TSV)-free interposer (TFI) technology eliminates TSV fabrication and reduces manufacturing and material cost. In this paper, structure-material-assembly-reliability-thermal (SMART) codesign modeling methodology is established for a package using TFI technology by considering wafer process, package assembly and package/board-level temperature cycling reliability, and thermal pe... View full abstract»

• ### Small-Scale HVDC Circuit Breaker

Publication Year: 2017, Page(s):1058 - 1068
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Circuit breakers are anticipated for fault isolation in multiterminal HVdc networks. However, there are remaining challenges concerning the circuit breaker topology and operation. The passive oscillation principle circuit breaker is one of the topologies under consideration, the design of which requires examination of the arc characteristics. The design process is therefore presented, with the aim... View full abstract»

• ### Development of a Wideband and High-Efficiency Waveguide-Based Compact Antenna Radiator With Binder-Jetting Technique

Publication Year: 2017, Page(s):254 - 260
| | PDF (2490 KB) | HTML

A multilayer waveguide-based antenna radiator is proposed to achieve a wide operational bandwidth of high gain and high efficiency in a compact size. It is a 2×2 array, consisting of a feeding waveguide, a matching cavity, and a radiating aperture. The proposed design provides sufficient freedom for the radiator to achieve broadband impedance matching. In order to improve radiation efficien... View full abstract»

• ### Waveguide-Stripline Series–Corporate Hybrid Feed Technique for Dual-Polarized Antenna Array Applications

Publication Year: 2017, Page(s):81 - 87
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This paper proposes a waveguide-stripline series-corporate hybrid feed technique to ease the feed-network design for dual-polarized antenna arrays. The hybrid feed network consists of a stripline series feed network and a waveguide-stripline corporate feed network, incorporating both of their advantages in one application. Furthermore, the design can efficiently simplify the manufacturing and pack... View full abstract»

• ### Wideband Filtering Balun on a Novel Hybrid Multimode Resonator With the Functionality of Vertical Transition

Publication Year: 2017, Page(s):1324 - 1330
| | PDF (1462 KB) | HTML

In this paper, a novel hybrid multimode resonator (MMR) is proposed and applied for design and exploration of a wideband filtering balun with the functionality of vertical transition. This hybrid MMR consists of two distinctive kinds of transmission lines: 1) microstrip line placed at the top and bottom layers, and 2) slotline formed on the middle common ground. With this combination, a hybrid MMR... View full abstract»

• ### Integration Design of Filtering Antenna With Load-Insensitive Multilayer Balun Filter

Publication Year: 2016, Page(s):1408 - 1416
| | PDF (3161 KB) | HTML

Integration design of a filtering antenna fed by a load-insensitive multimode balun bandpass filter is proposed in this paper. The balun filter is designed and realized using multilayer structure for miniaturization. To be directly integrated into the antenna, both amplitude and phase performances of the balun filter are investigated with different complex load impedances. With insensitive respons... View full abstract»

• ### Thermally Conductive MgO-Filled Epoxy Molding Compounds

Publication Year: 2013, Page(s):1994 - 2005
Cited by:  Papers (2)
| | PDF (3264 KB) | HTML

The use of magnesium oxide (MgO) as a filler in an epoxy molding compound (EMC) was considered to identify the maximum thermal conductivity that could be achieved without compromising rheological or processing control and processing flexibility. MgO is an attractive candidate filler for EMCs used in automotive and other applications because MgO is inexpensive, electrically insulative, has relative... View full abstract»

• ### Novel Active Bandpass Switchplexer for RF Transceiver Front-End Applications

Publication Year: 2017, Page(s):1516 - 1530
| | PDF (4894 KB) | HTML

In this paper, the design of RF transceiver front-end using a novel multifunction microwave circuit is proposed. By designing one arm of the proposed active bandpass switchplexer as a bandpass power amplifier (PA) and the other arm as a single-to-balanced bandpass low-noise amplifier (LNA), the resulted multifunctional microwave filtering device thus effectively integrates the functions of single-... View full abstract»

• ### Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Publication Year: 2017, Page(s):138 - 152
| | PDF (4122 KB) | HTML

Through silicon via (TSV)-based 3-D integrated circuit has introduced the solution to limitlessly growing demand on high system bandwidth, low power consumption, and small form factor of electronic devices. As the system design aims for higher performance, the physical dimensions of the channels are continuously decreasing. With TSV diameter of less than 10 μm and pitch of several tens of m... View full abstract»

• ### Package Inductors for Intel Fully Integrated Voltage Regulators

Publication Year: 2016, Page(s):3 - 11
Cited by:  Papers (8)
| | PDF (3209 KB) | HTML

Intel fourth-generation and fifth-generation Core microprocessors are powered by high-frequency integrated switching voltage regulators. The inductors required to implement these regulators are constructed using the routing layers of conventional organic flip chip packaging. This paper provides an overview of the construction of these inductors including representative results from production pack... View full abstract»

• ### Clock Jitter Reduction and Flat Frequency Generation in PLL Using Autogenerated Control Feedback

Publication Year: 2017, Page(s):1832 - 1841
| | PDF (1913 KB) | HTML

In this paper, a method has been proposed by which one can reduce the clock jitter and achieve almost flat frequency clock output from the phase-locked loop (PLL), independent of the power supply voltage fluctuation. These voltage fluctuations occur when a given chip comes out from the sleep mode to the active mode. This causes the chip to draw a hasty current, which in turn produces LdI/dt noise.... View full abstract»

• ### Electric Coupling Structure of Substrate Integrated Waveguide (SIW) for the Application of 140-GHz Bandpass Filter on LTCC

Publication Year: 2014, Page(s):316 - 322
Cited by:  Papers (17)
| | PDF (1219 KB) | HTML

Millimeter-wave (mmW) bandpass filters (BPFs) using substrate integrated waveguide (SIW) are proposed in this paper. The propagation constants of two different types of electromagnetic bandgap (EBG) units are discussed and compared for their passbands and stopbands performance. In among, the slotted-SIW unit shows a very good lower and upper-stopband performance. The mmW BPF with three cascaded un... View full abstract»

• ### Fabrication of Copper Electrode on Flexible Substrate Through Ag+-Based Inkjet Printing and Rapid Electroless Metallization

Publication Year: 2017, Page(s):1552 - 1559
| | PDF (1621 KB) | HTML

Thin film electrodes on a flexible substrate have attracted significant interests from the community for developing flexible and wearable electronics. A prompted routine for inkjet printing conductive patterns on a flexible plastic substrate is developed in this study, in which silver ion-based catalytic ink is utilized as a seed layer for electroless copper metallization in room temperature. Thro... View full abstract»

• ### A New IC Solder Joint Inspection Method for an Automatic Optical Inspection System Based on an Improved Visual Background Extraction Algorithm

Publication Year: 2016, Page(s):161 - 172
| | PDF (1914 KB) | HTML

In the field of automatic optical inspection (AOI), defect recognition for an integrated circuit (IC) solder joint is a long-standing task. Inspired by a visual background extraction (ViBe) algorithm, an object detection method in computer vision, we propose a new inspection method for IC solder joints with an improved ViBe algorithm. To the best of our knowledge, we are the first to consider the ... View full abstract»

• ### Fabrication of Solid-State Multilayer Glass Capacitors

Publication Year: 2017, Page(s):1906 - 1910
| | PDF (1347 KB) | HTML

Alkali-free glasses show immense promise for the development of high-energy density capacitors. The high breakdown strengths on single-layer sheets of glass suggest the potential for improved energy densities over existing state-of-the art polymer capacitors. In this paper, we demonstrate the ability to package thin glass to make solid-state capacitors. Individual layers are bonded using epoxy, le... View full abstract»

• ### Impact of Ground via Placement in Grounded Coplanar Waveguide Interconnects

Publication Year: 2016, Page(s):136 - 144
Cited by:  Papers (1)  |  Patents (1)
| | PDF (3617 KB) | HTML

Methods for higher order parallel plate mode suppression in grounded coplanar waveguides (GCPW) using unique ground via structures are presented in this paper. Suppression of these higher order modes can increase GCPW bandwidth. The ground via fence parameters that affect the bandwidth of the GCPWs are also discussed. Two new structures using staggered ground via fences and with defected side grou... View full abstract»

• ### A Low-Phase-Noise and Wide-Tuning-Range CMOS/IPD Transformer-Based VCO With High $mathrm {FOM}_{T}$ of −206.8 dBc/Hz

Publication Year: 2016, Page(s):145 - 152
Cited by:  Papers (3)
| | PDF (2074 KB) | HTML

This paper presents a low-phase-noise and wide-tuning-range voltage-controlled oscillator (VCO) implemented in a standard 0.18-μm complementary metal-oxide-semiconductor (CMOS) process with an integrated passive device (IPD) transformer. Even- and odd-mode oscillations of the transformer-based resonator can be achieved by the mode-switching topology, and the oscillations in the two modes re... View full abstract»

## Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

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## Meet Our Editors

Managing Editor
R. Wayne Johnson
Auburn University