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Circuits and Devices Magazine, IEEE

Issue 4 • Date July 1995

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Displaying Results 1 - 6 of 6
  • Setting the trap for hot carriers [MOS VLSI]

    Page(s): 18 - 24
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (542 KB)  

    The device degradation under ac and dc stress have been discussed and a relationship between the two has been established,. We have shown that the commonly used lifetime criteria of 10% linear current degradation for 10 years for a transistor under dc stress is overly conservative for representing the circuit operating lifetime. Using experimental and simulated data for inverter chains, we proposed that a meaningful equivalent lifetime based on 10% I/sub dl/ degradation under dc stress is 1 year lifetime (for a 10 year circuit lifetime based on 54b degradation in ring oscillator frequency). We also compared this criteria to actual circuit degradation for microprocessors and a DRAM. For DSP microprocessors with 0.8 μm LDD transistors, the projected lifetime was more than 200 years at 5.5 V, with a corresponding 10% I/sub dr/ lifetime of 20 years. For 1 Mb DRAMs with 1 pm LDD transistors, the 5% speed degradation lifetime at 5.5 V was more than 100 years, whereas the individual transistors had 10% I/sub dl/ lifetime of 4 years. These circuit results support the 10% I/sub dl/ transistor lifetime. We believe these criterion should be very safe and reasonable for digital IC chips currently in the field, as well as those in future design and development. View full abstract»

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  • Macromodeling ideal switches for SPICE

    Page(s): 8 - 10
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (204 KB)  

    Representing switches in terms of SPICE-acceptable elements is important for simulating DC-DC converters, switching mode power supplies, and power electronic circuits. Some time back, Xu and Yu [1988] proposed an equivalent circuit model for a switch employing independent and controlled voltage sources and resistors. Two basic questions come to mind in examining this model: (i) Is it possible to devise other equivalent models? (ii) If so, can we create superior models? The answer to both questions is yes View full abstract»

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  • Building the FO infrastructure for wireless communications

    Page(s): 13 - 17
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (444 KB)  

    The next generation of communication systems will provide consumers with a host of new and improved voice, video, and data services. Rapidly developing wireless radio systems are already contributing to the progress, giving consumers the luxury of tetherless access to telephone conversation, on-line computing, and cable-television. Indeed, wireless access to high quality information and entertainment is quickly becoming a key component of the information superhighway. In that context, optical fiber links, which have the bandwidth for providing users with the service of their choice, are an excellent connecting infrastructure for providing uniform radio coverage in wireless networks. Indeed, fast improving analog FO links will serve such networks well. In this article, we will analyze the requirements for such a system View full abstract»

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  • Improving plant performance

    Page(s): 46 - 47
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    The article addresses a method of improving plant operation by offering workers a part of the rewards for good work. The paper is written for those who are considering forming small businesses and who may want to consider the advantages of such a way of operating View full abstract»

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  • Known good die meets chip size package

    Page(s): 32 - 37
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (408 KB)  

    The increasing density, functionality, and high speed performance of integrated circuit components are fueling demands for smaller and faster portable electronic systems. Designers are becoming more experienced at cutting size, delays, and costs wherever possible. One area that offers attractive benefits for reducing size and improving performance is in the IC package itself, either eliminating it altogether, or reducing the size to the point where it takes up very little more space than the IC. In that context, chip size packages (CSPs) offer a viable solution to the problem. The electrical performance of a circuit is degraded by any capacitance, inductance, and lead length added to the IC bond pads. In addition to the performance limitations of the IC package itself, the larger footprint of the package implies that the next level of interconnect will also be sub optimal due to size and fanout of the IC interconnections. CSPs address these problems, too View full abstract»

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  • Handling multimedia information with VLSI

    Page(s): 25 - 31
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    Identifies the basic technological components of multimedia communications. Among these technologies, multimedia processing and transmission already benefit heavily from VLSI advances. in fact, these two technologies could not have matured without special-purpose VLSI chips. We have examined basic processing required in these technologies and some VLSI architectures. The focus has been on standard-compliant VLSI chips, because the eventual goal of communications is to allow everyone to reach others without constraints. There are still a number of evolving standards, which means that we might witness yet another wave of VLSI chips for multimedia communications View full abstract»

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Aims & Scope

IEEE Circuits and Devices Magazine (1985-2006) covers the design, implementation, packaging, and manufacture of micro-electronic and photonic devices, circuits and systems

 

This Magazine ceased publication in 2006.

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Meet Our Editors

Editor-in-Chief
Dr. Ronald W. Waynant
r.waynant@ieee.org