By Topic

Circuits and Devices Magazine, IEEE

Issue 4 • Date July 1995

Filter Results

Displaying Results 1 - 6 of 6
  • Setting the trap for hot carriers [MOS VLSI]

    Publication Year: 1995 , Page(s): 18 - 24
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (542 KB)  

    The device degradation under ac and dc stress have been discussed and a relationship between the two has been established,. We have shown that the commonly used lifetime criteria of 10% linear current degradation for 10 years for a transistor under dc stress is overly conservative for representing the circuit operating lifetime. Using experimental and simulated data for inverter chains, we propose... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Macromodeling ideal switches for SPICE

    Publication Year: 1995 , Page(s): 8 - 10
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (204 KB)  

    Representing switches in terms of SPICE-acceptable elements is important for simulating DC-DC converters, switching mode power supplies, and power electronic circuits. Some time back, Xu and Yu [1988] proposed an equivalent circuit model for a switch employing independent and controlled voltage sources and resistors. Two basic questions come to mind in examining this model: (i) Is it possible to d... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Handling multimedia information with VLSI

    Publication Year: 1995 , Page(s): 25 - 31
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (572 KB)  

    Identifies the basic technological components of multimedia communications. Among these technologies, multimedia processing and transmission already benefit heavily from VLSI advances. in fact, these two technologies could not have matured without special-purpose VLSI chips. We have examined basic processing required in these technologies and some VLSI architectures. The focus has been on standard... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Improving plant performance

    Publication Year: 1995 , Page(s): 46 - 47
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (172 KB)  

    The article addresses a method of improving plant operation by offering workers a part of the rewards for good work. The paper is written for those who are considering forming small businesses and who may want to consider the advantages of such a way of operating View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Building the FO infrastructure for wireless communications

    Publication Year: 1995 , Page(s): 13 - 17
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (444 KB)  

    The next generation of communication systems will provide consumers with a host of new and improved voice, video, and data services. Rapidly developing wireless radio systems are already contributing to the progress, giving consumers the luxury of tetherless access to telephone conversation, on-line computing, and cable-television. Indeed, wireless access to high quality information and entertainm... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Known good die meets chip size package

    Publication Year: 1995 , Page(s): 32 - 37
    Cited by:  Papers (1)  |  Patents (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (408 KB)  

    The increasing density, functionality, and high speed performance of integrated circuit components are fueling demands for smaller and faster portable electronic systems. Designers are becoming more experienced at cutting size, delays, and costs wherever possible. One area that offers attractive benefits for reducing size and improving performance is in the IC package itself, either eliminating it... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.

Aims & Scope

IEEE Circuits and Devices Magazine (1985-2006) covers the design, implementation, packaging, and manufacture of micro-electronic and photonic devices, circuits and systems

 

This Magazine ceased publication in 2006.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Dr. Ronald W. Waynant
r.waynant@ieee.org