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IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue 7 • July 2017

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Displaying Results 1 - 25 of 28
• Front Cover

Publication Year: 2017, Page(s): C1
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• IEEE Transactions on Components, Packaging and Manufacturing Technology publication information

Publication Year: 2017, Page(s): C2
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Publication Year: 2017, Page(s):1001 - 1002
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• Design, Fabrication, and Characterization of Dense Compressible Microinterconnects

Publication Year: 2017, Page(s):1003 - 1010
| | PDF (3748 KB) | HTML

This paper presents gold passivated NiW compressible microinterconnects (CMIs) with 75 μm height and 150 μm in-line pitch. The CMIs are batch fabricated using CMOS-compatible processes. The fabricated CMIs have a measured compliance of up to 13.12 mm/N and demonstrate 45 μm elastic vertical range of motion. Moreover, the CMIs are shown to return to their original geometrical p... View full abstract»

• Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration

Publication Year: 2017, Page(s):1011 - 1019
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This paper develops a bumpless wafer-on-wafer (WoW) memory integration approach in order to increase its throughput and reliability without sacrificing the electrical and mechanical performances compared to the bump-containing chip-on-chip (CoC) integration. The features are that through silicon vias are bottom-up filled after multilayer wafers bonding and connected to the predeposited redistribut... View full abstract»

• Improvements of System-in-Package Integration and Electrical Performance Using BVA Wire Bonding

Publication Year: 2017, Page(s):1020 - 1034
| | PDF (5179 KB) | HTML

In this paper, bond via array (BVA) wirebond is used to achieve compact vertical integration and improve the electrical performance for system in package (SiP). Two techniques are presented. In the first technique, BVA wirebonds are utilized to integrate some passive or active components vertically onto other components. This significantly reduces the horizontal footprint of the entire SiP. In ter... View full abstract»

• Differential Pad Placement Design of a Capacitive Coupling-Based Stacked Die Package

Publication Year: 2017, Page(s):1035 - 1042
| | PDF (1559 KB) | HTML

Stacked die package using capacitive-based chip-to-chip signaling offers low energy-per-bit costs and high I/O density. Many previously published works on capacitive proximity I/O have focused on mechanical methods for accurate chip alignment. This paper explores design considerations to address stacked die structures with differential signaling chip-to-chip communication based on capacitive coupl... View full abstract»

• Packaging of Small-Scale Thermoelectric Generators for Autonomous Sensor Nodes

Publication Year: 2017, Page(s):1043 - 1049
| | PDF (2364 KB) | HTML

This paper focuses on packaging of small-scale thermoelectric generators (TEGs) for energy harvesting applications in sensor nodes for industry 4.0 and for the Internet of Things. The TEGs are suitable to enable self-powered sensor systems with unlimited energy lifetime, but they have to withstand high mechanical loads during the assembly and packaging process and further stress due to the mismatc... View full abstract»

• Laser Sintering of Nano-Ag Particle Paste for High-Temperature Electronics Assembly

Publication Year: 2017, Page(s):1050 - 1057
| | PDF (3861 KB) | HTML

In this paper, we have investigated a laser-assisted fast nano-Ag sintering process for die attach in power electronic applications. The effects of laser power, irradiation time, and load on microstructure and shear performance of the bonded samples are presented. Moreover, samples sintered by a hotplate were also studied as a comparison. The results indicate that the die-attach process using the ... View full abstract»

• Small-Scale HVDC Circuit Breaker

Publication Year: 2017, Page(s):1058 - 1068
| | PDF (5833 KB) | HTML

Circuit breakers are anticipated for fault isolation in multiterminal HVdc networks. However, there are remaining challenges concerning the circuit breaker topology and operation. The passive oscillation principle circuit breaker is one of the topologies under consideration, the design of which requires examination of the arc characteristics. The design process is therefore presented, with the aim... View full abstract»

• Towards a 3-D Technique to Determine the Geometric Path of Electric Current Flow Through a Contact System

Publication Year: 2017, Page(s):1069 - 1080
| | PDF (2063 KB) | HTML

The effective conductivity of a contact system is an important characteristic used to link the microstructure of the contact system to its performance. A resistor network model has been developed from the cross-sectional slices of a given electrical contact system. This allows the total resistance across the model and hence the total conductance of the system to be calculated. This resistor networ... View full abstract»

• A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver

Publication Year: 2017, Page(s):1081 - 1088
| | PDF (1859 KB) | HTML

This paper studies the interaction of catastrophic failure of the driver and LED luminous flux decay for an integrated LED lamp with an electrolytic capacitor-free LED driver. Electronic thermal simulations are utilized to obtain the lamp's dynamic history of temperature and current for two distinct operation modes: constant current mode (CCM) and constant light output (CLO) mode, respectively. Dr... View full abstract»

• Thermomechanical Analysis and Characterization of a Press-Pack Structure for SiC Power Module Packaging Applications

Publication Year: 2017, Page(s):1089 - 1100
| | PDF (5632 KB) | HTML

This paper presents an experimental methodology for the characterization of thermomechanical displacement and friction properties in a free-floating press-pack structure, and evaluation of the tensile stress on the semiconductor die through simulation of different mechanical and thermal loading conditions. The press-pack structure consists of a single silver-metallized (1 μm) silicon carbid... View full abstract»

• Thermal Evaluation of 2.5-D Integration Using Bridge-Chip Technology: Challenges and Opportunities

Publication Year: 2017, Page(s):1101 - 1110
| | PDF (2993 KB) | HTML

In this paper, 2.5-D integrated circuits (ICs) using bridge-chip technology are thermally evaluated to investigate thermal challenges and opportunities for such multi-die packages. To this end, the objectives of this paper are twofold. First, thermal benchmarking of a number of 2.5-D integration approaches is performed and compared to 3-D ICs for completeness. Thermal modeling shows that the evalu... View full abstract»

• Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography

Publication Year: 2017, Page(s):1111 - 1118
| | PDF (2169 KB) | HTML

Solder joint provides electronic and mechanical connections between components and substrate. Overheating and excessive temperature gradient can cause solder joint failures and then make the whole system breakdown. Thus, thermal analysis has been the hotspot in reliability evaluation of electronic packaging. This paper proposes eddy current pulsed thermography (ECPT) to investigate thermal transfe... View full abstract»

• Single-Layer Broadband Phase Shifter Using Multimode Resonator and Shunt $\lambda$ /4 Stubs

Publication Year: 2017, Page(s):1119 - 1125
| | PDF (1718 KB) | HTML

This paper presents a new method for single-layer broadband phase shifter without needing any coupling structure. The phase shifter consists of a multimode resonator and two shunt λ/4 stubs. Meanwhile, the bandwidth of proposed phase shifters can be achieved more than 100%. For prescribed return loss, phase shift value, and phase error, this paper develops a synthesis approach to determine ... View full abstract»

• A Novel Two-Layer Low-Profile 23-GHz Microstrip Array Fed by Slots in an SIW for Wireless Backhauling Applications

Publication Year: 2017, Page(s):1126 - 1135
| | PDF (2701 KB) | HTML

This paper proposes a robust option for developing a new class of efficient and cheap antenna array based on patch array fed by substrate-integrated waveguide (SIW) through slot apertures for wireless backhauling applications. It consists in performing the feed network in SIW and the radiating structure in microstrip technology. The microstrip lines are coupled to the slots on the top wall of the ... View full abstract»

• Microwave Microstrip Six-Channel Triplexer and Eight-Channel Quadruplexer

Publication Year: 2017, Page(s):1136 - 1143
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This paper presents two microstrip multiband multiplexers using distributed coupling technique. The proposed multiband multiplexers consist of a distributed coupling feeding line, asymmetric stepped-impedance resonators, and output feeding lines. Each pair of resonators controls a respective bandpass channel for good design freedom. By using distributed coupling technique, there is no extra matchi... View full abstract»

• Compact Triple-Band Power Divider Integrated Bandpass-Filtering Response Using Short-Circuited SIRs

Publication Year: 2017, Page(s):1144 - 1150
| | PDF (1637 KB) | HTML

Based on short-circuited stepped-impedance resonators (SIRs), a triple-band power divider (PD) with bandpass-filtering response is presented. The triple-passband filtering response is achieved for the presented PD. The first and third passbands are realized by the short-circuited SIRs, while the second passband is introduced and tuned by half-wavelength resonators independently. The triple-passban... View full abstract»

• Frequency-Tunable Filtering Power Divider With New Topology

Publication Year: 2017, Page(s):1151 - 1162
| | PDF (2928 KB) | HTML

In this paper, we present a new frequency-tunable filtering power divider structure and its design method. For achieving the frequency filtering characteristic, the power divider uses a single resonator or multiple resonators. One of the unique features of the presented structure is that the last resonator is coupled to the two outputs, and this allows for minimizing the number of the resonators u... View full abstract»

• The Effect of Electrical Connector Degradation on High-Frequency Signal Transmission

Publication Year: 2017, Page(s):1163 - 1172
| | PDF (2269 KB) | HTML

Electrical connector failures may alter the signal that is being transmitted and is one of the major causes of low communication quality. As the connector degrades, the dc resistance and the impedance characteristics induced by the corrosion products should both be considered. In this paper, the effects of electrical connector degradation on its high-frequency behaviors were experimentally studied... View full abstract»

• Absorbing Termination for High-Frequency Measurements of Interconnects

Publication Year: 2017, Page(s):1173 - 1184
| | PDF (2822 KB) | HTML

In this paper, a novel termination (“match”) scheme is introduced with absorbing material for high-frequency measurements. Through the absorption of electromagnetic waves, absorbing material makes an equivalent absorbing boundary condition at the interface, which creates an equivalent termination condition. The absorbing termination can be used to facilitate on-demand match condition... View full abstract»

• Dear Society Members

Publication Year: 2017, Page(s): 1185
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• Blank page

Publication Year: 2017, Page(s): B1186
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• Introducing IEEE Collabratec

Publication Year: 2017, Page(s): 1187
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Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Meet Our Editors

Managing Editor
R. Wayne Johnson
Auburn University